2004 Invited Speakers
Lasers in Manufacturing
Photonics in Homeland and National Security
Lasers in Manufacturing
PTuB1, Ultrahigh precision machining using femtosecond laser sources,
Andreas Ostendorf; Laser Zentrum Hannover e.V., Germany.
PTuB2, State-of-the-art of laser annealing of Si for FPD applications,
James Im, Paul C. van der Wilt, Alex B. Limanov, Brandon A. Turk, Adrian
M. Chitu; Columbia Univ., USA.
PTuB3, Advanced laser annealing technology in FPD industries, Tomoyuki
Akashi, Toshio Kudo, Kazunori Yamazaki; Sumitomo Heavy Industries, Japan.
PTuB4, Yield improvement and flexible manufacturing of integrated circuits
through laser trim, Pradeep K. Subrahmanyan; Electro Scientific Industries,
Inc., USA.
PTuE1, Biochemical IC chips with light driven mechanism fabricated by hybrid
micro/nano stereolithography, Koji Ikuta; Nagoya Univ., Japan.
PTuE2, Laser micromachining by UV, deep UV and fs lasers, Jim Fieret;
Excitech, UK.
PTuE3, Laser micromachining using custom-based direct write and diffractive
optic focusing technologies, Osman Ghandour; OAG Labs. Inc., USA.
PWA1, Direct writing of improved microfludic mixers and artificial vasculatures
by high brightness diode pumped Nd-YAG laser, Jyoti Mazumder; Univ. of
Michigan, USA.
PWA2, State-of-the-art on micro-assembly using laser technology, Willem
Hoving; Philips Electronics Nederland B.V., Netherlands.
PWA3, 3-D nano- and micro-processing by femtosecond laser for photonic applications,
Eric Mazur; Harvard Univ., USA.
PWE1, High power laser machining: Applications and trends in Europe,
Eckhard Beyer; Fraunhofer Inst. for Material and Beam Technology IWS, Germany.
PWE2, Laser processing for wide bandgap semiconductor device fabrication,
Aravinda Kar1,, N. R. Quick2; 1CREOL, Univ. of Central Florida, USA, 2Applicote
Associates LLC, USA.
PWE3, Development of high power diode laser systems in the German national
diode laser research project "Modular Diode Laser Systems", Friedrich
Bachmann; ROFIN-SINAR Laser GmbH, Germany.
PThA1, 200W 2nd harmonic of DPSS YAG laser for poly-Si TFT manufacture,
Tetsuo Kojima, Eiichi Tanaka, Kazutoshi Morikawa, Tatsuki Okamoto, Junichi
Nishimae, Yukio Sato, Masaaki Tanaka; Mitsubishi Electronics, Japan.
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Photonics in Homeland
and National Security
PTuC1, Opto-electronics in defense applications, Robert Leheny; DARPA,
USA.
PTuC2, An introduction to the Homeland Security Advanced Research Projects
Agency (HSARPA), Steven Buchsbaum; Dept. of Homeland Security, USA.
PTuC3, Sensor integration for homeland defense: Opportunities for photonics
technology development, Kim Harrington, Seong Kim, Eric Johnson; Lockheed
Martin, USA.
PTuF1, Single-platform, multi-sensor system for airborne reconnaissance,
John Lee, Dale C. Linne von Berg, Melvin R. Kruer, Michael D. Duncan; NRL,
USA.
PTuF2, WDM networks and technology for aerospace platforms, Andrew
Glista; NAVAIR, USA.
PTuF3, Chirped-AM 3-D imaging laser radar for DOD applications, Greg
Sztankay; ARL, USA.
PWB1, Photonics in homeland security and national security, Jeff
Throckmorton; Hach Homeland Securities Technologies, USA.
PWF3, Passive uncooled imagers, Margaret Kohin, Roy Rumbaugh, Heather
Wickman; BAE Systems, USA.
PWF4, Passive electro-optical sensors research at RDECOM/CERDEC's Night
Vision & Electronic Sensors Directorate, Philip Perconti; NVESD,
AMSEL-NV-ST, USA.
PThB1, Laser radar and its application to homeland defense, Bill
Humbert; USAF/MNGS, USA.
PThB2, Photonic and IR countermeasures, Paul Egbert; BAE Systems,
USA.
PThB3, Advanced receiver technology for commercial threat warning systems,
William Clark1, William Waters1, Kenneth Vaccaro2;
1OptoGration Inc., USA, 2AFRL, Sensors Directorate, USA.
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